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  • Area Array Packaging Processes: for BGA, Flip Chip, and CSP

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

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Est. Date: Nov 28, 2025

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

  • Author(s): Ken Gilleo
  • Publisher: McGraw-Hill Professional
  • Language: en
  • Pages: 259
  • Binding: Hardcover
  • Edition: 1
  • Published: 2003-10-23
  • Dimensions: Height: 9.4 Inches, Length: 7.3 Inches, Weight: 1.41977696728 Pounds, Width: 0.96 Inches
  • Estimated Delivery: Nov 28, 2025
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