• Implementing Lead-Free Electronics

Implementing Lead-Free Electronics

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Est. Date: Nov 15, 2025

By 2006, any company selling electronics to European Union nations and China will have to convert to a lead-free manufacturing process. This resource shows manufacturers how to select the right Lead Free process and make the conversion as efficient and inexpensive as possible. Contents: Selecting Component Lead Coating * Selecting PCB Surface Finish * Manufacturing Approaches * Solder Paste Application * Reflow Soldering * Wave Soldering * Other Manufacturing Techniques and Common Defect Consideration * Reliability and Compatibility.

  • Author(s): Jennie S. Hwang
  • Publisher: McGraw Hill Professional
  • Language: en
  • Pages: 473
  • Binding: Hardcover
  • Edition: 1
  • Published: 2004-12-10
  • Dimensions: Height: 9.1 Inches, Length: 6.2 Inches, Weight: 1.86951998176 Pounds, Width: 1.64 Inches
  • Estimated Delivery: Nov 15, 2025
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