• Advances in Research and Development: Modeling of Film Deposition for Microelectronic Applications (Volume 23) (Thin Films, Volume 23)

Advances in Research and Development: Modeling of Film Deposition for Microelectronic Applications (Volume 23) (Thin Films, Volume 23)

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Est. Date: Nov 15, 2025

Significant progress has occurred during the last few years in device technologies and these are surveyed in this new volume. Included are Si/(Si-Ge) heterojunctions for high-speed integrated circuits, Schottky-barrier arrays in Si and Si-Ge alloys for infrared imaging, III-V quantum-well detector structures operated in the heterodyne mode for high-data-rate communications, and III-V heterostructures and quantum-wells for infrared emissions.

  • Author(s): Maurice H. Francombe
  • Publisher: Academic Press
  • Language: en
  • Pages: 311
  • Binding: Hardcover
  • Edition: 1
  • Published: 1997-10-13
  • Dimensions: Height: 9 Inches, Length: 6 Inches, Weight: 1.3668660244 Pounds, Width: 0.75 Inches
  • Estimated Delivery: Nov 15, 2025
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