• Encapsulation of Electronic Devices and Components

Encapsulation of Electronic Devices and Components

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Est. Date: Dec 27, 2025

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  • Author(s): Edward R. Salmon
  • Publisher: CRC Press
  • Language: en
  • Pages: 240
  • Binding: Hardcover
  • Edition: 1
  • Published: 1986-10-31
  • Dimensions: Height: 9.25 Inches, Length: 6.25 Inches, Weight: 1.19931470528 Pounds, Width: 1.5 Inches
  • Estimated Delivery: Dec 27, 2025
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