• Advances in Dielectric Materials and Electronic Devices Proceedings of the 107th Annual Meeting of The American Ceramic Society, Baltimore, Maryland, USA 2005

Advances in Dielectric Materials and Electronic Devices Proceedings of the 107th Annual Meeting of The American Ceramic Society, Baltimore, Maryland, USA 2005

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Est. Date: Jan 22, 2026

This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.

  • Author(s): K. M. Nair, Ruyan Guo, Amar S. Bhalla, D. Suvorov, S.-I. Hirano
  • Publisher: Wiley
  • Language: en
  • Pages: 336
  • Binding: Paperback
  • Edition: 1
  • Published: 2005-12-28
  • Dimensions: Height: 8.97636 Inches, Length: 5.94487 Inches, Weight: 1.06703734808 Pounds, Width: 0.728345 Inches
  • Estimated Delivery: Jan 22, 2026
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