Adhesive Bonding in Photonics Assembly and Packaging

Yacobi (U. of Toronto) and Hubert (Exfor Photonic Solutions, Canada) have expanded a review published in the Journal of Applied Physics on a subject crucial to a wide variety of applications in microelectronics and photonics assemblies and packaging and to the manufacturing of optoelectronic and fiber-optic components, and of medical devices. Photocuring of adhesives offers advantages related to its capabilities for instant cure, cure-on-demand, increased production speed, and ease of automation; but its use requires understanding of adhesion, optical, thermal, mechanical, and chemical properties. After an introductory chapter, material is arranged in sections on photonics components, assemblies, and devices; fundamentals of bonding; types of adhesives; photopolymerization techniques; applications in photonics; issues related to optical adhesive bonding; and future directions. Annotation (c) Book News, Inc., Portland, OR (booknews.com)