*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
| ISBN-13: | 9780071374934 |
| ISBN-10: | 0071374930 |
| Publisher: | McGraw-Hill Professional |
| Publication date: | 2001-11-05 |
| Edition description: | 1 |
| Pages: | 1000 |
| Product dimensions: | Height: 9.3 Inches, Length: 7.6 Inches, Weight: 3.84927109452 Pounds, Width: 2.33 Inches |
| Author: | Gilleo,Ken |
| Language: | en |
| Binding: | Hardcover |
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