In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
| ISBN-13: | 9781032470276 |
| ISBN-10: | 1032470275 |
| Publisher: | Taylor & Francis Limited (Sales) |
| Publication date: | 2024 |
| Edition description: | 1 |
| Pages: | 132 |
| Product dimensions: | Height: 9.61 inches, Length: 6.69 inches, Weight: 0.95 pounds, Width: 0.38 inches |
| Author: | King-Ning Tu, Yingxia Liu |
| Language: | en |
| Binding: | Hardcover |
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