This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
| ISBN-13: | 9781461492627 |
| ISBN-10: | 1461492629 |
| Publisher: | Springer New York |
| Publication date: | 2014-07-15 |
| Pages: | 402 |
| Product dimensions: | Height: 9.21 Inches, Length: 6.14 Inches, Weight: 1.85629224604 Pounds, Width: 0.94 Inches |
| Author: | Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu |
| Language: | en |
| Binding: | Hardcover |
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