• Advances in Cryogenic Engineering Materials Transactions of the International Cryogenic Materials Conference - ICMC, Vol. 54

Advances in Cryogenic Engineering Materials Transactions of the International Cryogenic Materials Conference - ICMC, Vol. 54

In stock (1 available)
SKU SHUB111211
$169 $120.95
Free Shipping within the US
Est. Date: Feb 5, 2026
Overview

All papers have been peer-reviewed. The 2007 joint Cryogenic Engineering Conference and International Cryogenic Materials Conference (CEC-ICMC) was held at the Chattanooga Convention Center in Chattanooga, TN, from July 16th through 20th. Nearly 700 attendees from 28 countries came together to enjoy the joint technical programs, industrial exhibit, and special events. There were 382 papers presented in plenary, oral, and poster sessions. Papers in the ICMC part of the conference covered the physical and mechanical properties of metals & alloys at cryogenic temperatures, insulation materials used in magnets for large-scale applications, recent developments in the conventional low-temperature superconductors, YBCO coated conductors, Bi-based superconductors, and MgB2 conductors. Conductor stability & AC losses as well as superconductor applications were also covered at this conference. ICMC papers selected after peer review process are published by AIP as Conference Proceedings Volume 986. Readers will get the latest information on materials and their properties used in cryogenic temperatures in this volume.

Product Details

ISBN-13: 9780735405059
ISBN-10: 0735405050
Publisher: American Inst. of Physics
Publication date: 2008-04-04
Edition description: 1
Pages: 584
Product dimensions: Height: 9.75 Inches, Length: 7.25 Inches, Weight: 2.7 Pounds, Width: 1.5 Inches
Author: U. Balachandran, Kathleen Amm, David Evans, Eric Gregory, Mike Osofsky, Sastry Pamidi, Chan Park, Judy Wu, Mike Sumption
Language: en
Binding: Hardcover

Books Related to Technology & Engineering

Discover more books in the same category

Customer Reviews

0.0 (0 reviews)
No Reviews Yet

Be the first to review this book!