Advances in Electronic Packaging, 2001 Presented at the Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition : July 8-13, 2001, Kauai, Hawaii

This three-volume set of the proceedings of the July 2001 conference presents information from both academia and industry on advances in electronic packaging. Volume 1 (75 papers) discusses electrical design, simulation, and test; MEMS; materials and processing; and modeling and characterization. Volume 2 (106 papers) covers thermal management reliability. Volume 3 (88 papers) addresses manufacturing, microelectronics systems and exploratory topics, optoelectronic and photonic packaging, RF microwave, telecommunications, education, and packaging technologies. It also contains a keynote lecture on consortium activity for system integration in Japan. There is no subject index. c. Book News Inc.