• Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335

Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335

In stock (3 available)
SKU SHUB179713
$85.56
Free Shipping within the US
Get it by: Jul 10, 2026
Overview

This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.

Product Details

ISBN-13: 9781605113128
ISBN-10: 1605113123
Publisher: Materials Research Society
Publication date: 2011-11-21
Edition description: 1
Pages: 140
Product dimensions: Height: 9.01573 Inches, Length: 5.98424 Inches, Weight: 0.771617917 Pounds, Width: 0.3751961 Inches
Author: Mikhail R. Baklanov, Geraud Dubois, Christian Dussarrat, Terukazu Kokubo, Shinichi Ogawa
Language: en
Binding: Hardcover

Books Related to Technology & Engineering

Discover more books in the same category

Customer Reviews