Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p
| ISBN-13: | 9780791815489 |
| ISBN-10: | 079181548X |
| Publisher: | Amer Society of Mechanical |
| Publication date: | 1996-01-01 |
| Pages: | 132 |
| Product dimensions: | weight: 340 g |
| Author: | Chao-Pin Yeh, Charles Ume |
| Language: | en |
| Binding: | Hardcover |
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