These proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. The volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers.
| ISBN-13: | 9780735403109 |
| ISBN-10: | 0735403104 |
| Publisher: | American Inst. of Physics |
| Publication date: | 2006-02-16 |
| Edition description: | 2006 ed. |
| Pages: | 372 |
| Product dimensions: | Height: 9.44 Inches, Length: 6.59 Inches, Weight: 1.63582998404 Pounds, Width: 0.98 Inches |
| Author: | Ehrenfried Zschech, Karen Maex, Paul S. Ho, Hisao Kawasaki, Tomoji Nakamura |
| Language: | en |
| Binding: | Hardcover |
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