• Stress-Induced Phenomena in Metallization Eighth International Workshop on Stress-Induced Phenomena in Metallization

Stress-Induced Phenomena in Metallization Eighth International Workshop on Stress-Induced Phenomena in Metallization

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Est. Date: Jan 4, 2026

These proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. The volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers.

  • Author(s): Ehrenfried Zschech, Karen Maex, Paul S. Ho, Hisao Kawasaki, Tomoji Nakamura
  • Publisher: American Inst. of Physics
  • Language: en
  • Pages: 372
  • Binding: Hardcover
  • Edition: 2006 ed.
  • Published: 2006-02-16
  • Dimensions: Height: 9.44 Inches, Length: 6.59 Inches, Weight: 1.63582998404 Pounds, Width: 0.98 Inches
  • Estimated Delivery: Jan 4, 2026
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