Stress-Induced Phenomena in Metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings (Numbered))
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SHUB111175
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Est. Date: Jan 21, 2026
The conference was on reliability related science in ULSI interconnect. Its main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. All papers were peer reviewed.
- Author(s): Shinichi Ogawa, Paul S. Ho, Ehrenfried Zschech
- Publisher: American Institute of Physics
- Language: en
- Pages: 204
- Binding: Hardcover
- Edition: Illustrated
- Published: 2007-11-13
- Dimensions: Height: 9.55 Inches, Length: 6.48 Inches, Weight: 1.01 Pounds, Width: 0.64 Inches
- Estimated Delivery: Jan 21, 2026
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