The conference was on reliability related science in ULSI interconnect. Its main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. All papers were peer reviewed.
| ISBN-13: | 9780735404595 |
| ISBN-10: | 0735404593 |
| Publisher: | American Institute of Physics |
| Publication date: | 2007-11-13 |
| Edition description: | Illustrated |
| Pages: | 204 |
| Product dimensions: | Height: 9.55 Inches, Length: 6.48 Inches, Weight: 1.01 Pounds, Width: 0.64 Inches |
| Author: | Shinichi Ogawa, Paul S. Ho, Ehrenfried Zschech |
| Language: | en |
| Binding: | Hardcover |
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