Surface Mount Technology: Recent Japanese Developments

Compiles translations of articles previously available only in the Japanese-language journal Surface Mount Technology . Coverage is grouped into six parts: trends in surface mount technology (SMT), SMT equipment, developments in solder technology, tape automated bending, chips on board technology, and multichip modules and printed circuit board technologies. The articles are extensively furnished with graphs, tables, figures and b&w photos a few of which are of inferior quality. Annotation copyright Book News, Inc. Portland, Or.