• Thin Films Stresses and Mechanical Properties VI 436

Thin Films Stresses and Mechanical Properties VI 436

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Overview

Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.

Product Details

ISBN-13: 9781558993396
ISBN-10: 1558993398
Publisher: Materials Research Society
Publication date: 1996-02-11
Edition description: 1
Pages: 542
Product dimensions: Height: 9.2 Inches, Length: 6.2 Inches, Weight: 2.05470828184 Pounds, Width: 1.3 Inches
Author: Shefford P. Baker, Huajian Gao, William W. Gerberich, Jan-Eric Sundgren
Language: en
Binding: Hardcover

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