• Advances in Electronic Packaging, 1997 Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : Presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

Advances in Electronic Packaging, 1997 Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : Presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

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Overview

These proceedings contain 302 papers presented at the June, 1997 conference. The papers are organized into five topical tracks: packaging technologies; emerging technologies; design, modeling and characterization; reliability; and thermal management. Topics within these tracks include advanced inter

Product Details

ISBN-13: 9780791815595
ISBN-10: 0791815595
Publisher: American Society of Mechanical Engineers
Publication date: 1997
Pages: 225
Product dimensions: Height: 10.75 Inches, Length: 8.5 Inches, Width: 2.75 Inches
Author: Ephraim Suhir
Language: en
Binding: Hardcover

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