• Area Array Packaging Processes: for BGA, Flip Chip, and CSP

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

In stock (1 available)
SKU SHUB52492
$129.5 $97.66
Free Shipping within the US
Est. Date: Feb 19, 2026
Overview

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Product Details

ISBN-13: 9780071428293
ISBN-10: 0071428291
Publisher: McGraw-Hill Professional
Publication date: 2003-10-23
Edition description: 1
Pages: 259
Product dimensions: Height: 9.4 Inches, Length: 7.3 Inches, Weight: 1.41977696728 Pounds, Width: 0.96 Inches
Author: Ken Gilleo
Language: en
Binding: Hardcover

Books Related to ELECTRONIC PACKAGING

Discover more books in the same category

Customer Reviews

0.0 (0 reviews)
No Reviews Yet

Be the first to review this book!