PACKAGINGRELIABILITY and MANUFACTURING ISSUES ASSOCIATED with ELECTRONIC and PHOTONIC PRODUCTS (I00533)

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION NOVEMBER 11-16, 2001 NEW YORK,NEW YORK Collection of 37 full-length, peer-reviewed technical papers that cover the leading edge in research and innovations in the following major topic areas: Thermal and Thermo-Mechanical Issues in Electronic Packaging; Nano-and Micro-Scale Compliant Interconnects for Electronic Packages; Thermal Management of Packaging Problems; Wafer and Electronic Manufacturing in Semiconductor Processing; Mechanics of SMT and Photonic Structures.