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  • Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)

Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)

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SKU SHUB131977
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Est. Date: Feb 19, 2026
Overview

Book by Johnson, R. Wayne, Teng, Robert K. F., Balde, John

Product Details

ISBN-13: 9780879422677
ISBN-10: 087942267X
Publisher: IEEE
Publication date: 1991
Pages: 616
Product dimensions: Height: 11.54 Inches, Length: 9 Inches, Weight: 3.75 Pounds, Width: 1.5 Inches
Author: R. Wayne Johnson, Robert K. F. Teng, John Balde
Language: en
Binding: Hardcover

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