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  • Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)

Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)

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Est. Date: Jan 7, 2026

Book by Johnson, R. Wayne, Teng, Robert K. F., Balde, John

  • Author(s): R. Wayne Johnson, Robert K. F. Teng, John Balde
  • Publisher: IEEE
  • Language: en
  • Pages: 616
  • Binding: Hardcover
  • Published: 1991
  • Dimensions: Height: 11.54 Inches, Length: 9 Inches, Weight: 3.75 Pounds, Width: 1.5 Inches
  • Estimated Delivery: Jan 7, 2026
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