Catalogue | Basi6Direct

Home
Catalogue
ELECTRONIC PACKAGING

ELECTRONIC PACKAGING

Items 1-9 of 9

Electronic Packaging Materials Science VII: Volume 323 (MRS Proceedings)

Electronic Packaging Materials Science VII: Volume 323 (MRS Proceedings)

$46.35
Get it by: Mar 26, 2026

Electronic Packaging Materials Science IV: Volume 154 (MRS Proceedings)

Electronic Packaging Materials Science IV: Volume 154 (MRS Proceedings)

$46.35
Get it by: Mar 26, 2026

Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)

Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)

$ 89.95
$76.15
Get it by: Mar 26, 2026

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications (Electronic Packaging and Interconnects, 2)

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications (Electronic Packaging and Interconnects, 2)

$ 109.99
$84.92
Get it by: Mar 26, 2026

PACKAGINGRELIABILITY and MANUFACTURING ISSUES ASSOCIATED with ELECTRONIC and PHOTONIC PRODUCTS (I00533)

PACKAGINGRELIABILITY and MANUFACTURING ISSUES ASSOCIATED with ELECTRONIC and PHOTONIC PRODUCTS (I00533)

$82.44
Get it by: Mar 26, 2026

Electronics Packaging Forum: Multichip Module Technology Issues

Electronics Packaging Forum: Multichip Module Technology Issues

$ 79.95
$66.04
Get it by: Mar 26, 2026

Surface Mount Technology with Fine Pitch Components: The manufacturing issues

Surface Mount Technology with Fine Pitch Components: The manufacturing issues

$ 199.99
$124.19
Get it by: Mar 26, 2026

Nanopackaging: Nanotechnologies and Electronics Packaging

Nanopackaging: Nanotechnologies and Electronics Packaging

$ 219.99
$69.20
Get it by: Mar 26, 2026

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

$ 129.5
$97.66
Get it by: Mar 26, 2026

Items 1-9 of 9